Auxiliary Gas︰N2 (99.99%) or (95%)N2 +(5%) H2
Application︰IC&LED Bonding Wire for Auto Bonder
Character︰High-tension Low Resisitivity
Wire Diameter (ψ) | mil | 0.7 mil | 0.8 mil | 0.9 mil | 1.0 mil | 1.2 mil | |
μm | 17.5±1 | 20±1 | 23±1 | 25±1 | 30±1 | ||
Mechanical Property (Room Temperature) |
Breaking Load (gf) | Room Temp | 6.5±3 | 8.5±3 | 11±3 | 14±3 | 19±3.5 |
High Temp. (250 ℃) | 5.5±3 | 7.5±3 | 10±3 | 13±3 | 18±3.5 | ||
Elongation (%) | 1.8±1.0 |
Auxiliary Gas︰N2 (99.99%) or (95%)N2 +(5%) H2
Application︰LED Bonding Wire for Manual Bonder
Character︰High-tension Low Resisitivity
Wire Diameter (ψ) | mil | 0.7 mil | 0.8 mil | 0.9 mil | 1.0 mil | 1.2 mil | |
μm | 17.5±1 | 20±1 | 23±1 | 25±1 | 30±1 | ||
Mechanical Property (Room Temperature) |
Breaking Load (gf) | Room Temp | 6.5±3 | 8.5±3 | 11±3 | 14±3 | 19±3.5 |
High Temp. (250 ℃) | 5.5±3 | 7.5±3 | 10±3 | 13±3 | 18±3.5 | ||
Elongation (%) | 1.8±1.0 |
Auxiliary Gas︰N2 Gas only
Application︰LED Bonding Wire for Manual Bonder
Character︰High-tension Low Resisitivity
Wire Diameter (ψ) | mil | 0.7 mil | 0.8 mil | 0.9 mil | 1.0 mil | 1.2 mil |
μm | 17.5±1 | 20±1 | 23±1 | 25±1 | 30±1 | |
Mechanical Property (Room Temperature) |
Breaking Load (gf) | 5.5±2.5 | 7.5±2.5 | 9.5±2.5 | 12±3.0 | 16±3.5 |
Elongation (%) | 10±2 |
Auxiliary Gas︰Forming Gas only
Application︰IC Bonding Wire for Auto Bonder
Character︰High-tension Low Resisitivity
Wire Diameter (ψ) | mil | 0.7 mil | 0.8 mil | 0.9 mil | 1.0 mil | 1.2 mil |
μm | 17.5±1 | 20±1 | 23±1 | 25±1 | 30±1 | |
Mechanical Property (Room Temperature) |
Breaking Load (gf) | 5.5±2.5 | 7.5±2.5 | 9.5±2.5 | 11.5±3 | 16±3 |
Elongation (%) | 10±2 |
Auxiliary Gas︰N2 (99.99%) or (95%)N2 +(5%) H2
Application︰LED Bonding Wire for Manual Bonder
Character︰High-tension Low Resisitivity
Wire Diameter (ψ) | mil | 0.7 mil | 0.8 mil | 0.9 mil | 1.0 mil | 1.2 mil |
μm | 17.5±1 | 20±1 | 23±1 | 25±1 | 30±1 | |
Mechanical Property (Room Temperature) |
Breaking Load (gf) | 5.5±2.5 | 7.5±2.5 | 9.5±2.5 | 11.5±3 | 16±3 |
Elongation (%) | 10±2 |
Auxiliary Gas︰N2 (99.99%) or (95%)N2 +(5%) H2
Application︰LED Bonding Wire for Manual Bonder
Character︰High-tension Low Resisitivity
Wire Diameter (ψ) | mil | 0.7 mil | 0.8 mil | 0.9 mil | 1.0 mil | 1.2 mil |
μm | 17.5±1 | 20±1 | 23±1 | 25±1 | 30±1 | |
Mechanical Property (Room Temperature) |
Breaking Load (gf) | 5.5±2.5 | 7.5±2.5 | 9.5±2.5 | 11.5±3 | 16±3 |
Elongation (%) | 10±2 |
2012年01月:取得美國專利證書 證書號碼:US8,101,123B2/US8,101,030B2
2012年10月:取得台灣專利證書 證書號碼:I373382
2013年02月:取得台灣專利證書 證書號碼:I384082
2013年03月:取得台灣專利證書 證書號碼:I394849、I395313、I396756
2013年09月:榮獲台灣102年國家發明創作獎-合金線材及製造方法
臺灣高科技業因全球整體產業環境改變而步入高度競爭與微利之時代,為求企業永續經營,將持續利用現有優勢,提供半導體產業更優良的合 金線材,以因應企業生產成本現實之嚴峻挑戰,並期許結合全體員工向心力,以優質的服務、持續的創新、精粹的技術永續經營成為百年企業。
『合金線』主要由不同金屬組成,物理性質在斷裂荷重、斷裂伸長、焊線後拉力及推力均優於純金線,導電性及熔斷電流、導熱率均可媲美純金線,但價格卻大幅低於純金線。
本公司生產的合金線規格齊全,線徑2.0~0.6mil(0.0500-0.0150mm),且可量身訂做適合客戶的機種,擁有強而有力的研發團隊與生產線以及深厚的技術根基為後盾,絕對可滿足您生產品質與價格的需求。